We successfully developed and commercialized the thermosetting conductive adhesive
film for FPC (TCBA-60Z) by applying our proprietary conductive bonding film technology. Since TCBA-60Z inherently comes with electrical conductivity on the adhesive x-layer, thus, exhibits a shielding effect when the on-board reinforcement plate is adhered to the FPC
with components such as smartphone camera module or LCD module. Moreover, the GND (grounding) circuit can be electrically connected in case the attached reinforcement plate
is a metal reinforcement plate such as SUS, therefore, TCBA-60Z enables to use the metal reinforcement plate as a shielding x-layer.
⦁ The GND circuit of the FPC and
the metal reinforcement plate are electrically connected to strengthen the GND.
⦁ After attaching the reinforcement plate to FPC, parts can be mounted on the Pb Solder Reflow.
⦁ Electromagnetic wave shielding function of FPC
⦁Width : 250mm, 500mm
⦁Thickness : 60㎛, 40㎛
⦁ Substitute for CBF-300 by Japan-based Tatsuta