1. Dicing tape Introduction
1) Non UV dicing tape is ideal for sawing of wafer while the die is saw, it can hold the die to avoid flying of chip.
1) Our Non-UV dicing tape has value for cost which is compared to other competitors and quality is stable too.
2) Our main customer is SAMSUNG semiconductor which is the 2nd largest company in this field, they are satisfied with high quality of our dicing tape.
3) Most of dicing tape is being produced by Japanese companies our dcing tape has been developed for the Japanese products so it has got cost competition.
4) UV-DICING TAPE has got stable cohesion when the wafer is saw and easy to be peeled off after UV irradiation. The current trend of using thin wafer, the UV dicing tape is being increased to be usded in semiconductors.
3. Features Ⅱ
1) Easy to pick up small chip after dicing
2) Cost competitive compare with most of Japanese competitor.
3) customer reference are variety
4) Thickness, color and size are variety
5) Products could be customized if the quantity is matched with our capability