High-polymer film of consumption is generally used on TFT-LCD Module and PDP Module process. Especially, it used in ACF - Bonding process( OLB, TAP Solder Process :Process Drive IC is attached on Glass panel by heating and pressing tool of ACF-Bonding machine ) of TFT-LCD Module, film’s function is shock-absorber of bonding tool and protecting glass panel from glass panel breaking damage cause by particle and unbalance of PCB size.