The microelectronics devices of the transistor type are known to expose some deterioration of performance when working at a high temperature as the internal heat generation takes place. Therefore, in order to prevent the deterioration of their performance, they need something like EMC of high thermal conductivity to emit the internally generated heat externally with ease.
The composition materials of the LMC-300T series are OCN type epoxy and contain crystalline silica for better thermal conductivity. In general, transistor microelectronics devices vary in terms of size, shape, and design structure of the lead frame. So in order to cover them, the LMC-300T series is made to have a excellent mold-ability. This also ensures reliability of devices.