Fully Automated Assembly Proess
Cycle Time 6~8sec/strip, Max,(based on PBGA)
Operation by Window NT
Individual Pin Transfer Fluxing Mechansism
Proprietary Vacuum Pick-up Mechanism
Proprietary Ball Dispensing Mechansism
Plastic BGA/Micro BGA/CSP Processing Capability
Interchangeable Tooling Capability
Short Conversion Time Max. 10min.
High Placement Accuracy ±0.1mm
High Yield 99.9%
High System Uptime 99.5%
Small Footprint 75" X 39"
Net weight 1,200kg
Low Cost Ownership
Easy and Friendly Operation
High Volume Manufacturing Possibility
Any Type of BGA Processing
Electrical:220Volt, Single Phase 50/60Hz, 15A
Air:60PSI Min, 100PSI Max.
50CFM clean dry air