The Pioneer 300 Wafer Surface Analysis System is specially designed for use in 300 mm
semiconductor wafer processing for quality control. The Pioneer 300 provides quick and
accurate contact angle/surface energy measurements of the wafer surface to adhesion,
cleanliness and surface treatments.
The use of anti-static materials in the Pioneer 300 makes it well suited for semiconductor
applications. The inner portions are specially designed to prevent particulate formation or
contamination and the system can be used to monitor the ultra clean surface processing
of silicon wafers. The position of the sample stage is computer controlled and can be
precisely adjusted along the x-,y-, or z- axis. The user can easily control the position of
the stage to allow for wafer surface mapping. The instrument uses micro-pump controlled
by PC for precise and repeatable liquid drop formation and application. This insures that a
reproducible drop volume is applied to the surface.