LIQUID PHOTOIMAGEABLE SOLDER RESIST INK

Payment

T/T
MOQ

Negotiable
Country of sale

World Wide
PRICE
- FOB
  
  Depend on quantity

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ITEM SPECIFICS

Brand

Unbranded

Model PHOTOMAGE SPI-707G TC
origin

Republic of Korea
Size(Capacity)

PRODUCT DESCRIPTION

This is an alkaline developing type of liquid solder resist ink. Additionally, the product is available for the manufacturing of high-density circuit boards required for precise circuits to offer outstanding resolution, heat resistance and adhesion

SCRL TECH 0102231

Liquid photoimageable solder resist ink for HASL : PHOTOMAGE SPI-707 TN

Specification			SPI-707(TN)
Color			Green, Blue, Red, Yellow
Viscosity (25℃, VT-04 type) PS		After Mixing	150∼300
Mixing ratio, Hardener (SH-2 TN)			Main Agent 7.5 : Hardener 2.5
Pot-life after the mixing at 20℃			48 hr
Shelf-life (20℃ in a dark place)			6 months
Pre-Curing at 80℃			Obverse 20min / Reverse 20min
Photo Exposure			400∼500 mJ/cm2
Developing (1wt% , 30℃)			60∼90 sec
Post-curing			150℃×50 min
Pencil Hardness			≥6H
Adhesion (JIS D0202)			100 / 100
Resistance to molten solder			288℃ ×10 sec, ≥3 times
Acid Resistance (10Vol% , 20℃)			≥20 min
Solvent Resistance (Methylene chloride, 20℃)			≥20 min
Electroless Gold Plating			Passed (Ni 3㎛, Au 0.03㎛)
Insulation Resistance Surface	Initial Value		≥1×10¹³Ω
	40℃ 90% RH 240hr		≥1×10¹²Ω
Major features			Suitable for general double sided PCB with an outstanding heat resistance and high resolution

* UL File No. : E99647

■ Packaging unit : 1kg

* Note : Data given here are the values obtained from our laboratory testing and not necessarily guaranteed values. Depending on the working condition, values may differ from our results, therefore, Customers are requested to conduct repeated testings to determine the best processing condition