Monitoring Burn-In Test System is a product verifying the reliability of Device by creating extreme conditions [applying electric signals and heat] on each Device for a specific time by placing al board within Chamber of MBT System by setting multiple Packaged Devices on Sockets of Board for verifying the reliability of Packaged Devices passed Wafer Test. APRO03700-FMH of FROM30 is a Multi-Flexible System equipped with various functions such as not only responding to existing high-speed D RAM as well as FLASH MEMORY, MCP[Multi Chip Package] Devices to respond to current semiconductor market situations and to USER Needs. * Applications - Package Burn In & Test - Memory Devices : All Memory Components (NAND-Flash , NOR-Flash , MCP, DRAM , SRAM etc) * Features - Ready/ Busy operation - Chip data information/ load function - Read/Write function (Imprint) - Single bit fail recovery (Programmable) - Fail memory for fail block address - MCP test is available in one test step (on the fly) - Fast fail block handling regardless of block size - Real time fail block monitoring