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Unbranded

Face Down

  • Payment
    T/T
  • MOQ
    Negotiable
  • Country of sale
    World Wide
  • PRICE
    • FOB

      Depend on quantity

ITEM SPECIFICS

  • Brand
    Unbranded
  • origin
    Republic of Korea
  • Size(Capacity)
* Near Chip Scale Package Outline * Ball pitch from 0.75mm to 1.0mm * Low profile 1.1mm height * Center bonding pad * JEDEC standard compliant

PAYMENTS DETAILS

This supplier supports payments for offline orders
  • Telegraphic Transfer : T/T
Contact Payment Manager
  • Name : YU, SAM-TAE
  • Tel : 82-0313233207
  • Email : samtryu@winpac.co.kr

SHIPPING

Shipping from : Republic of Korea
  • 351-25, Gachang-ri, Baegam-myeon, Yongin Si GYEONGGI-DO KOREA, 경기도,
Can't find a valid Shipping method for supplier account. Please contact the pertaining representative for detailed information.
WINPAC INC
  • The person in charge

  • Telephone

    82-0313233207
  • Fax

    031-323-3195
  • Address

    351-25, Gachang-ri, Baegam-myeon, Yongin Si GYEONGGI-DO KOREA, 경기도,
  • Business Type :
    Manufacturer
  • Main Product :
  • Established :
    2002

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COMPARISON TO SIMILAR ITEMS more

  • No Items
GOLD GOLD
WINPAC INC Seller's Store
  • Response Level
      41% ~ 50%
  • Supplier Level
      Less than 100 million (KRW)
  • Transaction Level
      less than 5
SUPPLIER BEST
  • Face Up
  • WLP(Wafer Level Package)