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Unbranded

WLP(Wafer Level Package)

  • Payment
    T/T
  • MOQ
    Negotiable
  • Country of sale
    World Wide
  • PRICE
    • FOB

      Depend on quantity

ITEM SPECIFICS

  • Brand
    Unbranded
  • origin
    Republic of Korea
  • Size(Capacity)
Opposed to the conventional package method, which performs sawing on individual chips, bond wire and molding attaching to the leadframe or substrate and completion by singulation, the wafer level package method carries out the photo process, etching process and other processes that are similar to those performed in Fab. with singulation as the final procedure. This can be applied to small, light-weight portable products such as cellular phones, PDAs and digital cameras as it is small sized owing to its real chip scale package and prominent electrical characteristics owing to its short electrical path.

PAYMENTS DETAILS

This supplier supports payments for offline orders
  • Telegraphic Transfer : T/T
Contact Payment Manager
  • Name : YU, SAM-TAE
  • Tel : 82-0313233207
  • Email : samtryu@winpac.co.kr

SHIPPING

Shipping from : Republic of Korea
  • 351-25, Gachang-ri, Baegam-myeon, Yongin Si GYEONGGI-DO KOREA, 경기도,
Can't find a valid Shipping method for supplier account. Please contact the pertaining representative for detailed information.
WINPAC INC

WINPAC INC

Seller_Mail
  • The person in charge

  • Telephone

    82-0313233207
  • Fax

    031-323-3195
  • Address

    351-25, Gachang-ri, Baegam-myeon, Yongin Si GYEONGGI-DO KOREA, 경기도,
  • Business Type :
    Manufacturer
  • Main Product :
  • Established :
    2002

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COMPARISON TO SIMILAR ITEMS more

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SILVER SILVER
WINPAC INC Seller's Store
  • Response Level
      41% ~ 50%
  • Supplier Level
      Less than 100 million (KRW)
  • Transaction Level
      less than 5
SUPPLIER BEST
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Gobiz Korea, as the operator of mediation service or mail-order broker, shall not be held responsible for the sale order.
The responsibility on the ordering, delivery, and product refund belongs to the seller.

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