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Image Sensor Package | Image Sensor, TSV, Interposer, 3D IC Stack, WLP, Via Filling
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Unbranded

Image Sensor Package

  • Payment
    T/T
  • MOQ
    Negotiable
  • Country of sale
    World Wide
  • PRICE

    • FOB

      Depend on quantity

ITEM SPECIFICS

  • Brand
    Unbranded
    Model FSI-TSV-XXXX
  • origin
    Republic of Korea
  • Size(Capacity)


PRODUCT DESCRIPTION

Introduction

- Front Side Illuminated CMOS Image Sensor Wafer Level Module

- Unique g-Stack Interconnection with Full Patented

- 1.3M to 5M Pixel CIS Wafer

- Pilot Production of 8 inch Wafer Available

PAYMENTS DETAILS

This supplier supports payments for offline orders
  • Telegraphic Transfer : T/T
Contact Payment Manager
  • Name : Gusung Kim

SHIPPING

Shipping from : Republic of Korea
  • 310, Adv. R&D KETI 68 Yatap-dong, Bundang-gu, Seongnam, Gyeonggi, KOREA, 경기도,
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EPworks Co.,Ltd.

EPworks Co.,Ltd.

Seller_Mail

  • The person in charge

  • Address

    310, Adv. R&D KETI 68 Yatap-dong, Bundang-gu, Seongnam, Gyeonggi, KOREA, 경기도,
  • Business Type :
    Manufacturer
  • Main Product :
  • Established :
    2006-01-01

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COMPARISON TO SIMILAR ITEMS more

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EPworks Co.,Ltd. Seller's Store
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  • Response Level
    ★ ★ ★ ★ ★   41% ~ 50%
  • Supplier Level
    ★ ★ ★ ★ ★   Less than 100 million (KRW)
  • Transaction Level
    ★ ★ ★ ★ ★   less than 5
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