- CMOS Image Sensor Camera Module of K9s major product is demonstrating its minimized size and excellent performance.
- K9’s CMOS camera module is smaller than any other by 30%, especially in terms of module height. K9s Flip Chip Technology is the answer. This is a stud-bumped COF(Chip-On-Flex) type which attaches a CMOS image sensor chip top to a flexible pattern circuit board by not Gold Wire but by Gold(Au) Stud Bump.
- The CMOS camera module, produced by Au Stud Bumping, allows our customers to develop the perfect mobile phones that deliver the very real image as it is. It can not only show excellent electrical conduction characteristic but also remove electrical noise considerably.
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