- Designed only for Flip Chip Device dealing with Boat
Handling and Strip type packages
- Application Range : Solder Ball Size : 0.30~0.76mm
PKG. Length : 180~250mm
PKG. Width : 28~70mm
- High Productivity with 6SPM (Strip Per Minute)
- Designed to minimize Down Time and Jamming
- 100% Ball Attachment by Compulsory Ejecting System
- Stable Flux Dotting by Pin Transfer application
- Vacuum Station Block for Warpage, Shrinage and Bent
handling
- Tools & QC Vision Inspection System (1st, 2nd Vision)
- Quick & Auto Conversion : below 5 Min.
PAYMENTS DETAILS
This supplier supports payments for offline orders