HT-160GSV and HT-170C series and one component, epoxy glues which cures on exposure to heat. very strong adhesion and high viscosity of uncured glue make it suitable to hold QFP and SOP IC to the PCB board firmly and can replace high temperature soldering lead. These glues can arrange QFP and SOP IC, etc in a line with soldering machine in manual work of special automation equipment.
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