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Unbranded

Automatic Optical Components Bonding & Chip Tester(ABCT)

  • Payment
    T/T
  • MOQ
    Negotiable
  • Country of sale
    World Wide
  • PRICE
    • FOB

      Depend on quantity

Trade Assurance Service

ITEM SPECIFICS

  • Brand
    Unbranded
  • origin
    Republic of Korea
  • Size(Capacity)
AWG Bonding & Chip tester (FA6100) FIBERPRO FA6100 series Auto-Alignment / Bonding system performs ultra-precise and high speed alignment in PLC chip based component manufacturing. FA6000 is designed with unique algorithm, which gives outstanding performance against competitors’. Moreover, the user-friendly features make it easy to learn and operate. Features Fastest available speeds(80Hz) High Resolution ( urad / sqrt(Hz) ) Intensity noise free Modular design for moving head Selectable light source by application Versatile use-i.e. glass, semiconductor, wave plates, visible, infrared materials Light weight All in one feature with Integrated circuit Custom made graphical user interface (GUI)

PAYMENTS DETAILS

This supplier supports payments for offline orders
  • Telegraphic Transfer : T/T

SHIPPING

Shipping from : Republic of Korea
  • Jang-dong, Yuseong-gu DAEJEON, 대전광역시,
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  • The person in charge

  • Telephone

    82-0423600030
  • Fax

    042-360-0040
  • Address

    Jang-dong, Yuseong-gu DAEJEON, 대전광역시,
  • Business Type :
    Manufacturer
  • Main Product :
  • Established :
    1997

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  • Response Level
      41% ~ 50%
  • Supplier Level
      Less than 100 million (KRW)
  • Transaction Level
      less than 5
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  • Automatic Optical Components Bonding & Chip Tester(ABCT)