AWG Bonding & Chip tester (FA6100)
FIBERPRO FA6100 series Auto-Alignment / Bonding system performs ultra-precise and high speed alignment in PLC chip based component manufacturing. FA6000 is designed with unique algorithm, which gives outstanding performance against competitors’. Moreover, the user-friendly features make it easy to learn and operate.
Fastest available speeds(80Hz)
High Resolution ( urad / sqrt(Hz) )
Intensity noise free
Modular design for moving head
Selectable light source by application
Versatile use-i.e. glass, semiconductor, wave plates, visible, infrared materials
All in one feature with Integrated circuit
Custom made graphical user interface (GUI)
This supplier supports payments for offline orders
Telegraphic Transfer : T/T
Shipping from :
Republic of Korea
Jang-dong, Yuseong-gu DAEJEON, 대전광역시,
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