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Unbranded

Package Substrate

  • Payment
    T/T
  • MOQ
    Negotiable
  • Country of sale
    World Wide
  • PRICE
    • FOB

      Depend on quantity

Trade Assurance Service

ITEM SPECIFICS

  • Brand
    Unbranded
  • origin
    Republic of Korea
  • Size(Capacity)
Non-memory package substrates are a new concept in circuit board design and are necessary for integrating semiconductor chips so that the chips can achieve full functionality. Package substrates enable a new type of chip integration that replaces the existing lead-frame integration. This business requires very advanced technology due to the high density level of the semiconductor chips. Simmtechs non-memory package substrate products include ball grid arrays (BGA), fpBGA, chip-size packages (CSP) and multi-chip modules (MCM), Demand for package substrates will grow significantly as we fully enter the digital era and the density of semiconductors gets even higher.

PAYMENTS DETAILS

This supplier supports payments for offline orders
  • Telegraphic Transfer : T/T
Contact Payment Manager
  • Name : Chun, Se-Ho
  • Tel : 82-0232186100
  • Email : shchun@simmtech.co.kr

SHIPPING

Shipping from : Republic of Korea
  • Yeoksam-dong, Gangnam-gu SEOUL, 서울특별시,
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SIMM TECH CO., LTD

SIMM TECH CO., LTD

www.simmtech.co.kr/ Seller_Mail
  • The person in charge

  • Telephone

    82-0232186100
  • Fax

    02-3218-6209
  • Address

    Yeoksam-dong, Gangnam-gu SEOUL, 서울특별시,
  • Business Type :
    Manufacturer
  • Main Product :
  • Established :
    1987

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COMPARISON TO SIMILAR ITEMS more

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  • Response Level
      41% ~ 50%
  • Supplier Level
      Less than 100 million (KRW)
  • Transaction Level
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