Non-memory package substrates are a new concept in circuit board design and are necessary for integrating semiconductor chips so that the chips can achieve full functionality.
Package substrates enable a new type of chip integration that replaces the existing lead-frame integration. This business requires very advanced technology due to the high density level of the semiconductor chips.
Simmtechs non-memory package substrate products include ball grid arrays (BGA), fpBGA, chip-size packages (CSP) and multi-chip modules (MCM), Demand for package substrates will grow significantly as we fully enter the digital era and the density of semiconductors gets even higher.
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