As one of the most advanced technologies for Fine Pitch, which is essentially required for miniaturization and light weight in the portable electronic instruments such as Mobile Phone, Smart Phone, Digital Camera, it is technology that directly connects Chip in Wafer Level with Substrate(Film, FPC, RF-PCB).
Our company establishes the optimal Bonding Condition and Process by selecting material and progressing artwork, in consideration of characteristics on IC and each Substrate from the development stage in order to develop and mass-produce the best products, and is coping with developing and mass-producing products with the aim of pursuing perfection in product through reliability test.
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Name : KIM, SUNG-MIN
Tel : 82-0313231980
Email : firstname.lastname@example.org
Shipping from :
Republic of Korea
593-2, Chang-ri, Namsa-myeon, Yongin Si GYEONGGI-DO, KOREA, 경기도,
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