Introduction

-EPworks Co. Ltd. was established for semiconductor package R&D services, product manufacturing Responsibimy and market sales.

EPworks has held a dominant position in its market in Korea and globally by combining 3D IC/TSV-WLP/lnterposer services with its progressive marketing plans and business strategies.

EPWorks named by Electro-Package Working Group for 3D IC and Package using TSV Study (Through-Si-Vias) Technology.

Company was named one of the Global Leading 3D IC Px-layers by Yole Developpment, Fr. EPWorks's trademark "g-STACK' technology has become the basis of all Tggeiher Wafer-to-Wafer technology for TSV-3D IC/Packages.

-3D IC/TSV-WLP/lnterposer Packaging, which utilizes semiconductor FAB technology, is the technology that has made Korea competitive in the semiconductor area and achieved semiconductor back-end.

-3D IC/TSV-WLP/lnterposer technology is the most efficient and optimal among the existing technologies for miniaturization and high functionality. Therefore EPWorks's business has a Low-Risk Model and High technology barrier model to entry.