[Product Introduction]
* Principle
By inducing cavitation in soldering agent,
- Remove surface layer(i.e. oxidation layer)
- Enhance solderability by inceasing mobility of soldering agent
- Remove bubbles between solid/liquid interface
- Enhance penetration of soldering agent into complex or tiny space
* Characteristics
- Applied to not only metals such as AI, Ni, but also glass and ceramics
- No flux needed, thus no flux rinsing process
- Reduced processing time, which increases productivity
- No pinholes are formed
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