Introduction
HIGH VACUUM OVEN (MODEL : TTOVEN-100)
This device is designed and manufactured mainly to aim at stabilizing the deposit film. this device is best suited to provide heat treatment for components which require a high level of stability.
Specification
CHAMBER SIZE |
500W * 350D * 540H (Inside) 440W * 330D * 60H (Heating zone) |
ULTIMATE PRESSURE |
under 5 * 10-6 Torr * 12 hours after degasing |
PUMPING SPEED |
5 * 10-5 Torr within 20 min (1 CHAMBER ) * room temperature |
HEATING TEMPERATURE |
MAX. 400℃ NOR. 300℃ |
HEAT UP TIME |
300℃. Approx. 1 hour |
HEATING UNIFORMITY |
300℃ ±15 ℃ |
ELECTRIC POWER |
AC 220V*, 3 phase, 50Hz, Approx. 30KVA |
COMPRESSED AIR |
Apporx. 5~7㎏/㎠G |
N2 GAS |
Apporx. 1㎏/㎠G |
COOLING WATER |
Room temp., Approx. 2 ㎏/㎠G, Approx. 12ℓ/min |
LAYOUT |
1,600W * 850D * 1,700H |
SYSTEM FRAME |
WITH COVER & CASTER |
CHAMBER |
500W * 440D * 540H (Inside) : 2 SETS |
PUMP |
CRYO PUMP (ULVAC) MODEL ; CRYO-U8H |
ELECTRICAL CONTROL |
FULL AUTOMATIC OPERATIONS BY PLC & TOUCH PANEL |
VACUUM GAUGE |
2 SETS |
HEATER BLOCK, CASE |
SUS 304 Each 5 Step : 2 SETS |
SHEATH HEATER |
Approx. 1.2KW * 6 Step : 2 SETS |
The person in charge
Telephone
82-07075840571Fax
032-277-0573Address
Galsan-dong, Bupyeong-gu, Incheon 403-080, Korea, 인천광역시,0 / 4000
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