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Unbranded

NeoPAC

  • Payment
    T/T
  • MOQ
    Negotiable
  • Country of sale
    World Wide
  • PRICE
    • FOB

      Depend on quantity

Trade Assurance Service

ITEM SPECIFICS

  • Brand
    Unbranded
  • origin
    Republic of Korea
  • Size(Capacity)

Introduction

NeoPAC WLP, is a wafer-level package (WLP)designed for image sensors. The NeoPAC WLP utilizes a glass wafer on which at least one patterned metal layer and one patterned passivation layer is fabricated. 

 

The image sensor is attached to the metal layer using ip chip solder joints.

Larger solder balls are used to connect the NeoPAC WLP to a PCB or excircuit.

This product is characterized by a simple structure that achieves high yield and

low cost through the use of standard and proven fabrication processes.

 

The product can be applied to camera phones, PC and laptop cameras, digital

cameras, camcorders, etc. In comparison to the existing methods of COB, CLCC and PLCC;

the NeoPAC WLP provides customers with a reliable product that is lower in cost and

smaller in size.

NeoPAC WLP is currently in use by numerous camera phones, PC cameras and other applications.

 

Established in October 2003, Optopacspecializes in the design, development and production of WLP (Wafer Level Package)

technology.

 

OptoPAC currently has 30 issued patents and has 25 pending patent applications.

Shipments in 2008 amounted to 70Million pcs.

 

Advantages of NeoPAC

Simple structure, with high yield and low cost using standard WLP fab processes.Better electrical and thermal performance.(Flip chip solder joint with lead-free solder)Wafer level chip scale package using glass wafers.(Known good die selection during –ip chip process)Compatible WLP packaging solution for most image sensors.(No change of sensor design)High reliability performance(Jedec level 1).

 

Size competitive when compared with COB/COF and CLCC.Module maker achieves high productivity with low capital investment as package is not sensitive to particles.Built-in IR Cut-o

PAYMENTS DETAILS

This supplier supports payments for offline orders
  • Telegraphic Transfer : T/T
Contact Payment Manager
  • Name : Kim, Deok-hun
  • Tel : 82-0432107403
  • Email : jayyun@optopac.com

SHIPPING

Shipping from : Republic of Korea
  • 1112-11,Namchon-Ri, Oksan-Myun, Cheongwon-Gun, Chungbuk, Korea(363-911), 충청북도,
Can't find a valid Shipping method for supplier account. Please contact the pertaining representative for detailed information.
OptoPAC INC.
  • The person in charge

  • Telephone

    82-0432107403
  • Fax

    043-218-7869
  • Address

    1112-11,Namchon-Ri, Oksan-Myun, Cheongwon-Gun, Chungbuk, Korea(363-911), 충청북도,
  • Business Type :
    Manufacturer
  • Main Product :
  • Established :
    2003

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COMPARISON TO SIMILAR ITEMS more

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OptoPAC INC. Seller's Store
Seller's Store url
  • Response Level
      41% ~ 50%
  • Supplier Level
      Less than 100 million (KRW)
  • Transaction Level
      less than 5
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