NeoPAC WLP, is a wafer-level package (WLP)designed for image sensors. The NeoPAC WLP utilizes a glass wafer on which at least one patterned metal layer and one patterned passivation layer is fabricated.
The image sensor is attached to the metal layer using ip chip solder joints.
Larger solder balls are used to connect the NeoPAC WLP to a PCB or excircuit.
This product is characterized by a simple structure that achieves high yield and
low cost through the use of standard and proven fabrication processes.
The product can be applied to camera phones, PC and laptop cameras, digital
cameras, camcorders, etc. In comparison to the existing methods of COB, CLCC and PLCC;
the NeoPAC WLP provides customers with a reliable product that is lower in cost and
smaller in size.
NeoPAC WLP is currently in use by numerous camera phones, PC cameras and other applications.
Established in October 2003, Optopacspecializes in the design, development and production of WLP (Wafer Level Package)
OptoPAC currently has 30 issued patents and has 25 pending patent applications.
Shipments in 2008 amounted to 70Million pcs.
Advantages of NeoPAC
Simple structure, with high yield and low cost using standard WLP fab processes.Better electrical and thermal performance.(Flip chip solder joint with lead-free solder)Wafer level chip scale package using glass wafers.(Known good die selection during –ip chip process)Compatible WLP packaging solution for most image sensors.(No change of sensor design)High reliability performance(Jedec level 1).
Size competitive when compared with COB/COF and CLCC.Module maker achieves high productivity with low capital investment as package is not sensitive to particles.Built-in IR Cut-o
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