- Burn In System : MCC HPB-5
- Board Meterial/x-layers : Polymide or equivalent/8~20 x-layers
- Individual Temperature control for each device under test up to 150W
- 800Amps of DUT power available per Burn In Board
- 128 I/O Channels
- DUT Density : 24ea / BIB
- Board Size : 570 mm X 640mm
Feature
- Appropriate to high current/power devices(up to 150 W)
- Individual DUT temperature control
- Individual DUT current monitoring
PAYMENTS DETAILS
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