• Ceramic Metallization
• Curing : 1450℃ -> MoMn
• Curing : 925℃ -> Cu
• Hybrid Integrated Ceramic Packages
• Origin : Republic of Korea
• Size : 100 x100
• Package Includes : Thick Film Ceramic Substrate
• Function : Ceramic Metallization
• Style : Ceramic Substrate
• Features : Hybrid Integrated Ceramic Packages
• Ceramic Substrate : Al2O3
• Paste : MoMn
We, Kostecsys Co., Ltd has concentrated on it with all abilities of the company for providing the best product and the best customer service based on innovation, creativeness, challenge spirit in fast-growing IT industry and a semiconductor components industrial market.
As a result Kostecsys was recognized as a global-leading company in field of IT industry and a semiconductor components industrial market by focusing on developing the advancing core technologies for RF power device PKG, LD PKG, RF parts, DBC board. Under the slogan of “Technology-First Ideology “Kostec has continued to invest in new technology and tried to improve the competitiveness in technology, as a result Kostec has accumulated the manufacturing technology in RF power device PKG, LD PKG, RF parts, DBC board for a lot of experience and the effort in spite of not being much of period.