[Feature]
• Cu-W, Cu-Mo is suitable for rolling and pressing process.
• Thermal expansion and thermal conductivity are adjustable
• Surface is pure Cu, the heat dissipation on surface layer is larger
• For wireless communication, power transistor substrate, etc.
• Heat Sink Materials & Thermal Conductivity (W/mk)
[Application]
• RF Power device pkg
• Automotive
[Specification]
• Origin : Republic of Korea
• Size : 20 x 10, etc
• Features : Cu-W, Cu-Mo is suitable for rolling and pressing process
• Function : Thermal expansion and thermal conductivity are adjustable
• Color : Yellow beige
• Style : HEATSINK
• SCMC(Cu/Mo/Cu/Mo/Cu) 300
• CMC 300
• CPC 220~260
• CuW 180~200
• CPC (Cu/CuMo/Cu) 180~220
• Electrolytic - Ni, Au,Pd, Ag, Cu
• Electroless - Ni, Au