Microelectronic Integrated Packages
Microelectronic Integrated Packages are it functions as an interface to protect the device from the external environment and to transmit signals to the inside and outside.
It is a high-precision microelectronic package that meets durability, mechanical impact, electrical and electronic properties, and thermal safety so it applicates industrial, military, hermetic rf connectors, hermetic dc connectors.
[Characteristic]
It is used as a hermetic terminal board.
· Insulation resistance :10,000MΩ/DC500V
· Operating temperature range : -65℃~150℃
· Hermeticity:Less than 1*10^-9 cc/sec
· Metal Packages
· Corrosion Resistance
· Semiconductor MEMS Sensor Package
[Application]
· Industrial, military, hermetic rf connectors, hermetic dc connectors, etc.
· Optical module for communication