Depend on quantity
FOB
Depend on quantity
Model | SF160ER |
Size | 500 x 550 mm |
Square measure | 1,460 x 1,480 x 1,400 ㎣ |
Weight | 2,000kg |
Detail |
( X-ray inspection equipment emphasizing practicality and precision )
-Main Feature
1. High resolutiob tube and detector 2. Convenient 2.5D View 3. Ultra-low table vibration 4. Fast table moving speed and high accuracy 5. Navigation function SF160ER is X-ray inspection equipment for research and analysis.
Using entry-level versions of existing SF160F modles, SF160ER is available to inspecion low-cost, high-efficiency operation. You can obtain high-definition and high-scale images from 160kV Micro-focus Open Tube and Flat Panel Detector. The vibration reduction device able to be fitted to allow for defect analysis with more precise image analysis. You can implement 2.5D scanning and choose a variety of options to customize production for your users and applications.
SF160ER is applicable SMT(Open, Crack, Cold Solder Joint), Semiconductor Packaging(Wire defect, Exfoliation, Void, Crack, MCP, TSV, FOB, Micro defect), Multix-layer PCB(Pattern Open/Short Via-Hole Alignment), Electronic components(Connector, Camera Module).
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Model | SF160N |
Size | 450 x 530 mm |
Square measure | 1,340 x 1,460 x 1,670 ㎣ |
Weight | 2,000kg |
Detail |
Hybrid Open Tube installed X-ray Inspection
High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard. Dual CT function can be purchased additionally, and exact location & size of defects can be detected and analyzed with this function. SF160N is applicable Sensor, Electronic Parts(ECU), Camera Module, Application Processor, PKG Chip, SMD/PCB, QFN/QFP, LED.
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Model | X-eye 5000N |
Size | 460 x 380 mm |
Square measure | 1,250 x 950 x 1,410 ㎣ |
Weight | 920kg |
Detail |
( X-ray inspection equipment suitable for mass production inspection S/W application )
It is equipped with a 100kV to 130kV Micro-focus Sealed Tube and a Flat Panel Detector with high-quality image. Especially, it is possible to obtain more precise and faster images during mass production inspection by upgrading from the existing one-arm structure to both-arm structure. It is designed for user convenience and can be customized for users and applications such as S/W, table size, etc. X-eye 5000N is applicable Sensor, Electronic Parts(ECU), Camera Module, PKG Chip, SMD/PCB, QFN/QFP, LED. |
Model | X-eye 7000B |
Size | 600 x 900mm |
Square measure | 2,040 x 1,900 x 2,360 ㎣ |
Weight | 5,300kg |
Detail |
( X-ray inspection equipment suitable fo Large Sized Metal Products )
- Non-destructive analysis system for the large-size components
- Various options for X-ray Tubes and Detectors - High power X-ray tube option Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products
Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc). Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables. Customization is available with selecting main parts by customers depends on their needs for size and material. X-eye 5000N is applicable IGBT, Die Casting, Prismatic/Cylindrical Battery, Mobile Battery, Automotive Battery.
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Model | Nano CT |
Size | Variable |
Square measure | 2,180 x 1,780 x 1,730 ㎣ |
Weight | 6,000kg |
Detail |
( Ultra-precision, ultra-high resolution high-end 2D, 3D CT X-ray examination equipment )
With the Focal spot 200nm-class tube developed by SEC, ultra-fine defects can be detected at least 1mm and ultra-precision tests can be performed with system precision of 100nm or less. Two X-ray detectors can be mounted, and the detector Z-axis can be varied, allowing you to freely change conditions such as geometric magnification and image brightness for the application. Detector tilt can be up to 80。 It minimizes image distortion during Oblique CT scans, provides high-quality 3D CT images with high external vibration blocking efficiency and minimal table interference. You can check most types of products such as Wafer level, PKG chip, trip, etc., TSV, BGA, Micro-bump,Various defects such as non-wet, HIP, Short, and open can be detected in the bonding wire.
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Model | X-eye 6200 |
Size | Max. 322 x 136 mm |
Square measure | 1,460 x 1,670 x 1,650 ㎣ |
Weight | 2,900kg |
Detail |
( World Only available Wire Auto X-ray Inspection System )
- Semiconductor and SMT 2D Auto Inspection Machine
- Substrate & JDEC Tray & Carrier - 4 High AXI System High Accuracy & Reliability, High Speed(Min. 0.5sec/FOV), ultra-High Resolution, High Cost benefit Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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Model | X-eye 6300 |
Size | Min : 50 x 50 (mm), Max : 330 x 250 (mm) |
Square measure | 1,360 x 1,880 x 1,700 ㎣ |
Weight | 4,200kg |
Detail |
( World's Highest Scale, High Resolution 3D CT Auto X-ray Inspection Equipment )
- High speed 3D In Line Inspection System (~4.3 sec/FOV)
- Hybrid Tube with long life span for In-line purpose (10,000hrs/Filament) - Best Solution for both-side x-layered PCB Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography. Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue. Inspection speed of 3.5sec/FOV from loading to automatic Good/NG judgement. In addition, 70 ̊ Tilt of Oblique CT enables accurate examination, and 3D images accurately detect defects in overlapping areas that are difficult to read with 2D & 2.5D images. In particular, the volume of the Void inside the BGA is accurately calculated by using Voxel to detect defective products.
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Model | X-eye 7300 |
Size | 150 X 150mm |
Square measure | 1,500 x 1,780 x 1,730 ㎣ |
Weight | 2,900kg |
Detail |
(3D CT AXI equipment exclusively for mass production inspection of assembly electronic components )
The world's only assembly electronic components, small die casting products, etc. can be inspected automatically and can be used reliably for a long time using the same Hybrid Tube as the 4 High AXI system. In particular, a 3D CT examination with the Cone beam CT method is conducted to accurately detect defects in overlapping areas that are difficult to read with 2D and 2.5D images. X-eye 7300 is applicable Electronic Parts(ECU), Die Casting, SMD/PCB, QFN/QFP. |
Model | NF120AW |
Size | Max. 300mmØ(12 inch) |
Square measure | 2,380 x 1,450 x 2,120 ㎣ |
Weight | 6,350 kg |
Detail |
( Wafer level Product In-line(Ireland) 2D, 3D CT AXI Machine )
Automatic inspection equipment exclusively for the Wafer level products, and ultra-fine defects of mm can be detected using the Nano Tube of Class Focal spot 200nm. 2D, as well as 7070。 Tilt's oblique CT method, accurately detects defects in overlapping areas that are difficult to read with 2D and 2.5D images in 3D images. In addition, X-ray Image Free Technique of the check can be applied to minimize the damage received by semiconductors. |
The person in charge
Jonghyun KimAddress
111 Saneop-ro 155beon-gil Gwonseon-gu, Suwon-si, Gyeonggi-do (16648)Please enter the text on the left image to prevent automatic input.
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