The person in charge
JEONG WON YOUNG
Address
602 Yeongdong-daero, Gangnam-gu, Seoul (06083)
Introduction
HPM GLOBAL INC
CEO Message
Plant Innovation &
Development of Eco Packages
Would like to inform that on the occasion of 30th anniversary since its foundation
Dear valued customers :
As a global converter of 35 years with diverse expertise in packaging development, we take pride in addressing the following achievements of our company over recent years
* New Printing Methodology with the Idealliance G7 Master Certification. This enables us to achieve consistent print quality and color control for all products.
* ESA (Electro-Static Assistance) Equipment to improve the transfer of inks and minimize dot skipping.
* Accumulated Technology for Pouch Making (flat,standup, flat-bottom box, and other specially shaped types)
* Spout welding Technology (center, corner, and any other position)
* Laser scoring enabling implementation of easy-cut, easy-tear features.
Development of Eco-Packages
Apart from the above technological advancements, we are deeply involved in the upcoming presentation of our new achievements in eco-packages aiming for lower CO2 emissions and mono-materials for recycling.
Where I would like to draw your particular attention is to one of the principal aims of our research activities for developing ecological packages with fewer layers and reduced weight (gsm). The retortable grade of pouches with sterilization at over 121°C will be among them.
In line with our research and development plans as such, we are continuously upgrading our plant and have made a timely investment. The aforementioned systems and our new recently installed flat-bottom pouch machine is a part of our given investment plan for the growing future market.
Thank you.
Address : Suite No. 804, 602, Yeongdong-daero, Gangnam-gu, Seoul, South Korea
E-mail : info@hpmglobal.com / sales@hpmglobal.com
Tel : 82-2-551-5981Fax : 82-2-551-5987